What are the alternative materials to liquid conformal coatings?

April 11, 2017 alternative, Atomic layer deposition (ALD), Blog, conformal coating, Molecular vapour deposition, Parylene

There are several alternative coatings available to the traditional conformal coating materials.

These alternative coatings include:

Parylene and other Chemical Vapour Deposition (CVD) films
Fluorinated ultra-thin and thin film coatings
Molecular Vapour Deposition (MVD) coatings
Atomic Layer Deposition (ALD) coatings

They can provide extremely high protection to circuit boards if used correctly for the right product.

There are several new and old alternative coatings available to the traditional conformal coating materials. They include Parylene, fluorinated Nano-coatings, Molecular Vapour Deposition (MVD) and Atomic Layer Deposition (ALD) thin films.

Parylene (XY) coatings

Parylene is the trade name for a variety of chemical vapor deposited poly(p-xylylene) polymers used as moisture and dielectric barriers.

Parylene is a conformal coating that is deposited as a gas in a vacuum chamber.

It is a dry process compared to the standard “wet” liquid conformal coatings.

Fluoropolymer (FC) coatings

Surface Modifiers are ultra thin coatings that are applied at less than a few microns in thickness.

Liquid conformal coatings are applied in the range of 25-75um so they are considerably thicker in nature.

There are several variations in ultra thin conformal coatings out in the market now but two of the most popular types are liquid materials and partial vacuum deposition.

Atomic layer deposition (ALD)

ALD belongs to the family of chemical vapor deposition methods (CVD).

It is a deposition process at a Nano-scale level within a vacuum chamber.

The deposition process forms ultra-thin films (atomic layers) with extremely reliable film thickness control.

This provides for highly conformal and dense films at extremely thin layers (1-100nm).

Molecular vapour deposition (MVD)

MVD belongs to both the families of chemical vapor deposition (CVD) and atomic layer deposition (ALD) methods.

Unlike traditional CVD and ALD flow systems the MVD reaction takes place in a chamber under static pressure resulting in extremely low chemical use.

The MVD process produces highly conformal thin film coatings, typically less than 100nm in thickness.

The coating provides excellent barrier properties and surface energy control.

Need to know more about alternative materials to the traditional liquid conformal coatings?

Give us a call at (+44) 1226 249019 or email your inquiries at sales@schservices.com

The ABCs of Atomic Layer Deposition (ALD)

March 16, 2017 Blog, Uncategorized

What is ALD?

Atomic Layer Deposition (ALD) belongs to the family of Chemical Vapour Deposition methods (CVD).

It is a deposition process at a nano-scale level within an enclosed vacuum chamber.

The deposition process forms ultra-thin films (atomic layers) with extremely reliable film thickness control.

This provides for highly conformal and dense films at extremely thin layers (1-100nm).

What coatings are deposited in ALD?

ALD principally deposits metal oxide ceramic films.

These films range in composition from the most basic and widely used aluminum oxide (Al2O3) and titanium oxide (TiO2) up to mixed metal oxide multilayered or doped systems.

How does ALD work in practice?

The ALD deposition technique is based upon the sequential use of a gas phase chemical process.

Gases are used to grow the films onto the substrate within a vacuum chamber.

The majority of ALD reactions use two chemicals called precursors. These precursors react with the surface of a material one at a time in a sequential, self-limiting, manner.

Through the repeated exposure to alternating gases there is a build up of a thin coating film.

Where is ALD used?

ALD is used in many different areas including:

Micro-electronics
Semiconductors
Photovoltaics
Biotechnology
biomedical
LEDs
Optics
Fuel cell systems

Advantages and disadvantages of ALD

Advantages

Self-Limiting. The ALD process limits the film thickness. Many other processes like Parylene are dependent upon amount of dimer and will continue to deposit successive polymer layers until it is completely used up.
Conformal films. ALD film thickness can be uniform from end to end throughout the chamber. Other coatings like Parylene can have a varied coating thickness across the chamber and the devices being coated.
Pinhole free. ALD films can be pinhole-free at a sub-nanometer thickness. Parylene and some other materials are only pinhole-free at micron levels.
ALD allows layers or laminates. Most other films including Parylene are single component layers.

Disadvantages

High purity substrate. This is very important to the quality of the finish similar to many other vapour deposition processes.
ALD Systems can range anywhere from $200,000 to $800,000 based on the quality and efficiency of the instrument. This tends to be 3-4 times the prices of a Parylene system.
Reaction time. Traditionally, the process of ALD is very slow and this is known to be its major limitation.
Masking challenges. The ALD masking process must be perfect. Any pinhole in the masking process will allow deposition beyond the masking barrier.